XC3S50AN-5FTG256C

Product Overview

Category

The XC3S50AN-5FTG256C belongs to the category of Field-Programmable Gate Arrays (FPGAs).

Use

FPGAs are integrated circuits that can be programmed and reprogrammed to perform various digital functions. The XC3S50AN-5FTG256C is specifically designed for applications requiring moderate logic capacity and high-performance features.

Characteristics

• Logic Capacity: Moderate
• Performance: High
• Programmability: Flexible
• Integration: On-chip resources for efficient implementation

Package

The XC3S50AN-5FTG256C comes in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package.

Essence

The essence of the XC3S50AN-5FTG256C lies in its ability to provide a customizable and reconfigurable hardware platform for digital circuit design and implementation.

Packaging/Quantity

The XC3S50AN-5FTG256C is typically packaged individually and is available in various quantities depending on the manufacturer or distributor.

Specifications

• Manufacturer: Xilinx Inc.
• Model: XC3S50AN-5FTG256C
• Logic Cells: 5,000
• Flip-Flops: 2,500
• Block RAM: 36 Kbits
• Clock Management Tiles: 4
• I/O Pins: 100
• Operating Voltage: 1.2V
• Speed Grade: -5
• Temperature Range: Commercial (0°C to 85°C)
• Package Type: FBGA
• Package Pins: 256

Detailed Pin Configuration

The XC3S50AN-5FTG256C has a total of 256 pins, each serving a specific purpose in the FPGA's functionality. The detailed pin configuration can be found in the manufacturer's datasheet.

Functional Features

The XC3S50AN-5FTG256C offers several functional features that make it suitable for a wide range of applications:

1. Programmability: The FPGA can be programmed and reprogrammed to implement various digital functions, allowing for flexibility in design.
2. High Performance: With its high-speed architecture and efficient on-chip resources, the XC3S50AN-5FTG256C delivers excellent performance for demanding applications.
3. Integration: The FPGA integrates multiple on-chip resources such as block RAM, clock management tiles, and I/O pins, enabling efficient implementation of complex designs.
4. Versatility: The XC3S50AN-5FTG256C supports a variety of interfaces and protocols, making it compatible with diverse system requirements.

Advantages and Disadvantages

Advantages

• Flexibility in design due to programmability
• High-performance capabilities
• Efficient utilization of on-chip resources
• Compatibility with various interfaces and protocols

Disadvantages

• Moderate logic capacity compared to higher-end FPGAs
• Limited I/O pins compared to larger FPGAs

Working Principles

The XC3S50AN-5FTG256C operates based on the principles of reconfigurable hardware. It consists of an array of configurable logic blocks interconnected through programmable routing resources. These logic blocks can be programmed to perform specific digital functions by configuring the interconnections and functionality of the internal elements.

Detailed Application Field Plans

The XC3S50AN-5FTG256C finds applications in various fields, including but not limited to:

1. Communications: Used in wireless communication systems, network routers, and data transmission equipment.
2. Industrial Automation: Employed in control systems, robotics, and process automation.
3. Automotive: Integrated into automotive electronics for functions like engine control, driver assistance systems, and infotainment.
4. Aerospace: Utilized in avionics systems, satellite communication, and navigation equipment.
5. Consumer Electronics: Found in high-end audio/video equipment, gaming consoles, and smart home devices.

Detailed and Complete Alternative Models

1. XC3S200AN-4FTG256C: Offers higher logic capacity with 20,000 logic cells.
2. XC3S1000AN-5FTG256C: Provides increased performance with 1,000,000 system gates.
3. XC3S4000AN-6FTG256C: Suitable for applications requiring extensive logic resources with 4,000,000 system gates.

These alternative models offer varying levels of logic capacity and performance to cater to different project requirements.

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