XA6SLX9-3FTG256I

Product Overview

Category: Integrated Circuit (IC)

Use: The XA6SLX9-3FTG256I is a programmable logic device designed for various digital applications. It offers high-performance and flexibility, making it suitable for a wide range of electronic systems.

Characteristics: - Programmable Logic Device - High-performance - Flexible configuration options - Versatile application possibilities

Package: The XA6SLX9-3FTG256I comes in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. This package provides excellent thermal performance and compact size, making it ideal for space-constrained designs.

Essence: The XA6SLX9-3FTG256I is the core component of many digital systems, enabling designers to implement custom logic functions and optimize system performance.

Packaging/Quantity: The XA6SLX9-3FTG256I is typically sold individually or in reels containing multiple units, depending on the supplier's packaging options.

Specifications

The XA6SLX9-3FTG256I offers the following specifications:

• Logic Cells: 6,144
• Look-Up Tables (LUTs): 4,608
• Flip-Flops: 9,216
• Block RAM: 270 Kb
• Maximum Frequency: 300 MHz
• I/O Pins: 196
• Operating Voltage: 1.2V
• Package Type: FBGA
• Temperature Range: -40°C to +100°C

Detailed Pin Configuration

The XA6SLX9-3FTG256I has a total of 256 pins. The pin configuration is as follows:

• Pin 1: VCCIO
• Pin 2: GND
• Pin 3: VCCINT
• Pin 4: GND
• ...
• Pin 256: NC (No Connect)

For a complete pin configuration diagram, please refer to the datasheet provided by the manufacturer.

Functional Features

The XA6SLX9-3FTG256I offers several functional features that enhance its usability and performance:

1. Programmability: The device can be programmed to implement custom logic functions, allowing designers to tailor it to specific application requirements.
2. High-Speed Operation: With a maximum operating frequency of 300 MHz, the XA6SLX9-3FTG256I can handle demanding digital systems that require fast data processing.
3. Flexible I/O Options: The device provides a generous number of I/O pins (196), enabling seamless integration with other components and peripherals.
4. Embedded Memory: The built-in Block RAM (270 Kb) allows for efficient storage and retrieval of data within the device itself, reducing the need for external memory components.

Advantages and Disadvantages

Advantages: - Versatile programmability - High-performance operation - Compact package size - Ample I/O options - Embedded memory for efficient data handling

Disadvantages: - Limited logic cell count compared to higher-end models - Higher power consumption compared to low-power alternatives

Working Principles

The XA6SLX9-3FTG256I operates based on the principles of field-programmable gate arrays (FPGAs). It consists of configurable logic blocks (CLBs), interconnect resources, and I/O elements. The CLBs contain look-up tables (LUTs) and flip-flops that can be interconnected to create custom logic functions. The interconnect resources allow for routing signals between different CLBs and I/O elements. By programming the device, designers can configure the interconnections and logic functions to achieve the desired system behavior.

Detailed Application Field Plans

The XA6SLX9-3FTG256I finds applications in various fields, including:

1. Embedded Systems: The device can be used in embedded systems to implement custom control and data processing functions.
2. Communications: It is suitable for communication systems that require high-speed data handling and protocol implementation.
3. Industrial Automation: The XA6SLX9-3FTG256I can be utilized in industrial automation systems for real-time control and monitoring tasks.
4. Medical Electronics: It finds application in medical devices where programmable logic is required for signal processing and control functions.
5. Consumer Electronics: The device can be integrated into consumer electronics products such as gaming consoles, smart appliances, and multimedia devices.

Detailed and Complete Alternative Models

1. XA6SLX16-2CSG324I: Similar to XA6SLX9-3FTG256I but with higher logic cell count (16,384) and more I/O pins (324).
2. XA6