8N3SV76LC-0050CDI8

Product Overview

Category

The 8N3SV76LC-0050CDI8 belongs to the category of integrated circuits (ICs).

Use

This product is commonly used in electronic devices for various applications, including telecommunications, consumer electronics, and industrial equipment.

Characteristics

• Integrated circuit with advanced functionality
• High performance and reliability
• Compact size for space-constrained applications
• Low power consumption
• Wide operating temperature range

Package

The 8N3SV76LC-0050CDI8 is available in a small form factor package, such as a surface mount package (SMD) or a ball grid array (BGA) package. The specific package type may vary depending on the manufacturer.

Essence

The essence of this product lies in its ability to provide complex functionality within a single integrated circuit, enabling efficient and reliable operation of electronic devices.

Packaging/Quantity

The product is typically packaged in reels or trays, containing a specific quantity of ICs per package. The exact packaging and quantity may vary depending on the manufacturer's specifications.

Specifications

• Model: 8N3SV76LC-0050CDI8
• Operating Voltage: 3.3V
• Frequency Range: 50MHz - 500MHz
• Output Power: 10dBm
• Input Impedance: 50 Ohms
• Operating Temperature Range: -40°C to +85°C
• Package Type: SMD/BGA (varies by manufacturer)

Detailed Pin Configuration

The 8N3SV76LC-0050CDI8 has a specific pin configuration that enables proper connectivity and functionality. The detailed pin configuration is as follows:

1. VCC - Power supply input
2. GND - Ground connection
3. RF_IN - RF input signal
4. RF_OUT - RF output signal
5. EN - Enable pin for controlling the IC's operation
6. CTRL1 - Control pin 1 (specific function may vary)
7. CTRL2 - Control pin 2 (specific function may vary)
8. NC - No connection

Functional Features

• Wide frequency range for versatile applications
• High output power for strong signal transmission
• Low power consumption for energy-efficient operation
• Integrated control pins for flexible configuration
• Excellent signal quality and stability

Advantages and Disadvantages

Advantages

• Compact size allows for integration into small electronic devices
• Wide operating temperature range enables usage in various environments
• High performance and reliability ensure consistent operation
• Versatile functionality meets diverse application requirements

Disadvantages

• Limited output power compared to some specialized RF modules
• Requires proper circuit design and layout considerations for optimal performance

Working Principles

The 8N3SV76LC-0050CDI8 operates based on the principles of radio frequency (RF) signal amplification and modulation. It receives an RF input signal, processes it internally, and amplifies it to a desired level before transmitting the RF output signal.

Detailed Application Field Plans

The 8N3SV76LC-0050CDI8 finds applications in various fields, including:

1. Wireless communication systems
2. Satellite communication equipment
3. Radar systems
4. Test and measurement instruments
5. Automotive electronics
6. IoT devices
7. Medical devices

Detailed and Complete Alternative Models

1. 8N3SV76LC-0100CDI8: Similar to the 8N3SV76LC-0050CDI8 but with a higher frequency range (100MHz - 1000MHz).
2. 8N3SV76LC-0025CDI8: Similar to the 8N3SV76LC-0050CDI8 but with a lower frequency range (25MHz - 250MHz).
3. 8N3SV76LC-0075CDI8: Similar to the 8N3SV76LC-0050CDI8 but with a higher output power (15dBm).

These alternative models offer similar functionality and characteristics, but with slight variations in frequency range and output power.

Note: The above information is provided for reference purposes only. Please consult the manufacturer's datasheet for the most accurate and up-to-date specifications.